Name: MVME6100-0161 Single Board Computer
Price: 2111 CNY
Availability: InStock

Description

Board component temperatures are affected by ambient temperature, air flow, board electrical operation, and software operation. In order to evaluate the thermal performance of a circuit board assembly, it is necessary to test the board under actual operating conditions. These operating conditions vary depending on system design. While Motorola performs thermal analysis in a representative system to verify operation within specified ranges, refer to Appendix A, Specifications, you should evaluate the thermal performance of the board in your application. This appendix provides systems integrators with information which can be used The preferred measurement location for a component may be junction, case, or air as specified in the table. Junction temperature refers to the temperature measured by an on-chip thermal device.
Case temperature refers to the temperature at the top, center surface of the component. Air temperature refers to the ambient temperature near the component.configuration. It identifies thermally significant components and lists the corresponding maximum allowable component operating temperatures. It also provides example procedures for component-level temperature measurements.
Measure the case temperature at the center of the top of the component. Make sure there is good thermal contact between the thermocouple junction and the component. We recommend you use a thermally conductive adhesive such as Loctite 384. If components are covered by mechanical parts such as heatsinks, you will need to machine these parts to route the thermocouple wire. Make sure that the thermocouple junction contacts only the electrical component. Also make sure that heatsinks lay flat on electrical components.

MVME6100-0161

MVME6100-0161 PDF

MVME6100

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