Name: MVME332XTP Motorola Single Board Computer new and original
Price: 3544 CNY
Availability: InStock

Description

Environmental Monitoring

A temperature sensing circuit is located on the I/O distribution board to monitor the temperature in the CPU Module. The I/O distribution board can monitor a maximum of three high-temperature sensing circuits from the VME Expansion Module. The sensor combines the ability to detect ambient temperature fluctuations and airflow changes through the chassis. Environmental conditions are sensed based on how effectively self-heating devices within the computer chassis are cooled.

By installing this sensor inside the VME Expansion Module and the SCSI Device Expansion Module, the sensor’s output can be monitored to ensure proper cooling within the chassis. The sensor’s output is fed into an analog comparator, whose threshold is calibrated for proper operation.

The I/O distribution board notifies the operating system if high operating temperatures are reached inside the module due to stopped fans, clogged filters, or high ambient temperature. The ENV Monitor circuit is equipped with two over-temperature trip points, which are present in the SCSI Device Expansion Module, CPU Module, and VME Expansion Module.

Over-Temperature Response for SCSI Modules

If the first trip point is reached in one of the SCSI Modules, an “interrupt request” process is initiated. If the second trip point is reached before the software completes the shutdown process, DC power to that SCSI Module is cut off.

The software system shutdown proceeds until it either stops or finishes, depending on which SCSI device is experiencing the over-temperature issue. An over-temperature LED on the faulty SCSI device illuminates to indicate the failure. A system over-temperature failure message should also appear on the system console. DC power for the entire system is then cut off either manually by the user or automatically by the software. This event should rarely occur, as the temperature should not rise quickly enough to trigger the second trip point.

Over-Temperature Response for CPU/VME Expansion Modules

If the first over-temperature trip point is reached on the CPU Module or any VME Expansion Module, the I/O distribution board generates an interrupt to the CPU board, and the software shutdown process begins. If the second trip point is reached before the software finishes shutting down, DC power to the entire system is 切断. This prevents damage to the system if temperatures in any module rise excessively.

Once the system shuts down due to an over-temperature condition, an operator must manually restart it by switching the reset/power on-off switch (located on the front panel) to the reset position. If the fault is caused by an AC power failure and the system shuts down, restoring AC power is sufficient for the system to power up and reboot the system software without human intervention.

MVME332XTP PDF MVME332XTP

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