Name: MVME167-002BE Motorola PLC Single-Board Computer
Price: 5454 CNY
Availability: InStock

Description

Features
Features of the MVME167-002BE are listed below.
❏ MC68040 Microprocessor at 25 MHz (-00X models), or 33 MHz (-03X models)
❏ 4/8/16/32/64MB of 32-bit DRAM with parity protection or 4/8/16/32/64/128/256MB of DRAM with ECC protection
❏ Four 44-pin PLCC ROM sockets (organized as two banks of 32 bits)
❏ 128KB SRAM (with optional battery backup)
❏ Status LEDs for FAIL, STAT, RUN, SCON, LAN, +12V (LAN power), SCSI,and VME.
❏ 8K by 8 RAM and time of day clock with battery backup
❏ RESET and ABORT switches
❏ Four 32-bit tick timers for periodic interrupts
❏ Watchdog timer
❏ Eight software interrupts
❏ I/O
– SCSI Bus interface with DMA
– Four serial ports with EIA-232-D buffers with DMA
– Centronics printer port
– Ethernet transceiver interface with DMA
❏ VMEbus interface
– VMEbus system controller functions
– VMEbus interface to local bus (A24/A32,
D8/D16/D32 (D8/D16/D32/D64BLT) (BLT = Block Transfer)
– Local bus to VMEbus interface (A16/A24/A32, D8/D16/D32)
– VMEbus interrupter
– VMEbus interrupt handler
– Global CSR for interprocessor communications
– DMA for fast local memory – VMEbus transfers (A16/A24/A32,D16/D32 (D16/D32/D64BLT)

Cooling Requirements
The Motorola MVME167-002BE VMEmodule is specified, designed, and tested to operate reliably with an incoming air temperature range from 0° to 55° C(32° to 131° F) with forced air cooling at a velocity typically achievable by using a 100 CFM axial fan. Temperature qualification is performed in a standard Motorola VMEsystem chassis. Twenty-five watt load boards are inserted in two card slots, one on each side, adjacent to the board under test, to simulate a high power density system configuration. An assembly of three axial fans, rated at 100 CFM per fan, is placed directly under the VME card cage. The incoming air temperature is measured between the fan assembly and the card cage, where the incoming airstream first encounters the module under test. Test software is executed as the module is subjected to ambient temperature variations. Case temperatures of critical, high power density integrated
circuits are monitored to ensure component vendors specifications are not exceeded.
While the exact amount of airflow required for cooling depends on the ambient air temperature and the type, number, and location of boards and other heat sources,adequate cooling can usually be achieved with 10 CFM and 490 LFM flowing over the
module. Less airflow is required to cool the module in environments having lower maximum ambients. Under more favorable thermal conditions, it may be possible to operate the module reliably at higher than 55° C with increased airflow. It is important
to note that there are several factors, in addition to the rated CFM of the air mover,which determine the actual volume and speed of air flowing over a module.

MVME167-002BE PDF
MVME167-002BE

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