Name: MVME133SA MOTOROLA PC BOARD
Price: 4322 CNY
Availability: InStock

Description

1. Core Features

The features of the MVME133 include:

Double-high/single-wide VME board

VMEbus Master Compatibility:

Address 24/Data 32 (A24/D32) (A24/D16 compatible) – applicable to MVME133S, MVME133S-001

Address 32/Data 32 (A32/D32) (A32/D16, A24/D32, A24/D16 compatible) – applicable to MVME133SA-020

MC68020 Microprocessor (32-bit address and data capabilities)

1MB shared local dynamic RAM (32 bits wide, accessible from VMEbus)

Four 28-pin JEDEC sockets for ROMs/PROMs/EPROMs/EEPROMs (arranged in two 16-bit-wide banks; maximum total capacity: 256KB)

Three 8-bit programmable timers (supports tick and watchdog functions)

Time-of-day clock/calendar (real-time clock, model: MM58274A)

Front-panel asynchronous serial debug port: DB25 RS-232C (integrated with MC68901 MFP)

Dual multiprotocol (synchronous/asynchronous) serial ports (model: Z85C30):

Port A: RS-485/RS-422A

Port B: RS-232C

VMEbus system controller functions (includes level 3 arbiter)

Single-level bus requester (level selectable via jumper)

VMEbus interrupter

VMEbus interrupt handler (supports all seven interrupt levels)

Front-panel status LEDs: RUN, HALT, FAIL

Front-panel switches: RESET, ABORT

Remote reset functionality (via edge connector P2)

Five-position software-readable header (part of Module Status Register, MSR)

2. Physical & Environmental Parameters

Parameter	Specification
Operating Temperature Range	-40°C to 85°C
Relative Humidity	5% to 90% (non-condensing)
Length	9.187 inches (233.35 mm)
Height	6.299 inches (160.0 mm)
Thickness	0.063 inches (1.6 mm)
Connectors	DIN No. 41612C96 male (P1, P2); DB-25 female (J14)

3. Cooling Requirements

The MVME133 is specified, designed, and tested for reliable operation under the following cooling conditions:

Incoming air temperature range: 0°C to 55°C (with forced air cooling)

Typical required airflow: 71 CFM (achievable via an axial fan)

Test Configuration (for temperature qualification):

Conducted in a standard Motorola VMEsystem chassis.

25-watt load boards inserted in two adjacent card slots (one on each side of the MVME133) to simulate high-power-density system conditions.

Three axial fans (71 CFM each) placed directly under the VME card cage.

Incoming air temperature measured between the fan assembly and card cage (where airflow first contacts the MVME133).

Test software executed during ambient temperature variations; case temperatures of high-power-density ICs monitored to ensure compliance with component vendor specifications.

General Airflow Guidelines:

Minimum recommended airflow: 10 CFM (150 LFM) over the module (sufficient for most environments).

Lower airflow may be acceptable in environments with lower maximum ambient temperatures.

Higher ambient temperatures (exceeding 55°C) may require increased airflow to maintain reliable operation.

Note: Actual airflow over the module depends on factors beyond fan CFM rating (e.g., chassis design, heat source distribution).

4. FCC Compliance Conditions

The MVME133 was tested in an FCC-compliant chassis and meets Class A equipment requirements. Compliance is achieved only under the following conditions:

a. Shielded cables used for all external I/O ports.

b. Cable shields connected to earth ground via metal-shell connectors (bonded to a conductive module front panel).

c. Conductive chassis rails connected to earth ground (provides a path for shield-to-earth grounding).

d. Front-panel screws properly tightened.

MVME133SA pdf
MVME133SA

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