Description
ABB 5SHX 1060H0003 High-Power IGBT Module
1. Pre-Operation Safety
CRITICAL REQUIREMENTS:
- Discharge DC link capacitors to <50V (verified with CAT IV 1000V meter).
- Lock out/tag out all power sources (NFPA 70E Hazard Risk Category 4).
- Use insulated tools (VDE 1000V rated).
- Grounding: Module baseplate-to-chassis <0.5 mΩ (4-wire Kelvin test).
2. Mechanical Installation
graph LR
A[Clean Heat Sink] --> B[Apply Thermal Paste<br/>Dow Corning DC-340 (0.1mm±0.02)]
B --> C[Position Module:<br/>Align M10 Mounting Holes]
C --> D[Torque Sequence:<br/>1-2-3-4 @ 35 Nm ±3%]
D --> E[Connect Cooling Manifold:<br/>DN25 Threads @ 50 Nm]
► Critical Spacing:
- Phase-to-phase clearance: ≥25mm (IEC 61800-5-1)
- Maintenance access: Front ≥600mm, Rear ≥300mm
3. Electrical Connections
| Terminal | Function | Specification |
|---|---|---|
| DC+/DC- | DC-Link Input | 3300Vdc max, 3000A surge |
| AC U/V/W | Phase Output | Cu busbars only (120mm² min) |
| G1-G6 | Gate Driver Signals | Twisted pair + foil shield |
| E1/E2 | Voltage Sensing | 18AWG silicone shielded |
| T+/- | Temperature Sensor | PT100 Class A (4-wire) |
Wiring Rules:
- Busbar rise ≤35°C at 1800A RMS
- Gate wires: ≤0.5m length, no splices
- Shield grounding: Single-point at driver unit
4. Pre-Energization Checks
- Insulation Test:
- DC+/DC- to baseplate: >100MΩ @ 5000VDC (IEC 62477-1)
- Static Tests:
Test Method Pass Value Diode Forward Drop 10A current injection V<sub>f</sub> ≤ 1.8V Gate-Emitter Leakage 20V applied, 25°C I<sub>leak</sub> < 500nA - Cooling Validation:
- Flow rate: ≥15 l/min
- ∆P: <1.5 bar
- Conductivity: <0.5 μS/cm
5. Power-Up Sequence
- Apply auxiliary power (+24VDC) to gate driver
- Ramp DC link at ≤100V/s to nominal voltage
- Verify:
- Driver status LED = Solid green
- ∆T heat sink <5°C between IGBTs
- Test firing pulses:
- 5% V<sub>dc</sub> with <10% current imbalance
6. Operational Monitoring
| Parameter | Normal Range | Shutdown Threshold |
|---|---|---|
| Case Temperature | ≤85°C | >90°C (I²t protection) |
| V<sub>CE</sub> sat | ≤3.1V @ 1800A | >3.5V (phase loss) |
| Leakage Current | <100mA | >250mA (ARC guard) |
► Maintenance Trigger:
- Gate resistance drift >±10% from baseline
- Thermal paste degradation >0.15°C/W
7. Critical Warnings
- NEVER disconnect gate wires under load
- Torque Verification: Re-check after 500 thermal cycles
- Storage: Nitrogen-purged container @ 25±5°C, <40% RH
- Disposal: Follow EU RoHS 2011/65/EU for Pb-containing solder
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